Brand：Frontier Semiconductor
Model：Film Adhesion
Film Adhesion
Film adhesion testing of thin films and stacks on substrates for material evaluation
3DIC TSV and BWS TTV
Film Stress
FEOL Electrical Characterization
Thin wafer metrology
Film Adhesion
Film adhesion testing
of thin films and stacks on substrates
for material evaluation.
FSM offers two techniques suitable for low and medium adhesion strength tests.
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Tel：86-021-37018108
Fax：86-021-57656381
Email：info@boyuesh.com
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